Lee W, Blade S, Hou Y, McIver A, Yang R, Liu X, Richardson AG A miniature wireless device for closed-loop auditory sleep modulation , 12th International IEEE EMBS Conference on Neural Engineering (NER), 12: 2025,1-4

Shankar S, Chen Y, Averbeck S, Hendricks Q, Murphy B, Ferleger B, Driscoll N, Shekhirev M, Takano H, Richardson A, Gogotsi Y, Vitale F Transparent MXene microelectrode arrays for multimodal mapping of neural dynamics , Advanced Healthcare Materials, 14(4): 2025,2402576

Huang Y, Liu B, Hou Y, Xu J, You H, Hung A, Ghosh S, Liu E, Yang N, Ma J, Cai H, Kondrataviciute L, Deng Q, Kalia SK, Richardson AG, Hsieh P-H, Genov R, Liu X A neuroprosthetic SoC with sensory feedback featuring frequency-splitting-based wireless power transfer with 200 Mb/s, 0.67 pJ/b backscatter data uplink and unsupervised multi-class spike sorting , IEEE International Solid-State Circuits Conference (ISSCC), 2025: 2025,272-274

Ramayya AG, Buch V, Richardson A, Lucas T, Gold JI Human response times are governed by dual anticipatory processes with distinct neural signatures , Communications Biology, 8(1): 2025,124

Du L, Ding Y, Hao H, Richardson AG, Zhao J, Van der Spiegel J, Aflatouni F, Lucas TH, Allen MG Optical transparent packages for implantable devices , SPIE Photonics West, 13323: 2025,13

Buch VP, Brandon C, Ramayya AG, Lucas TH, Richardson AG Dichotomous frequency-dependent phase synchrony in the sensorimotor network characterizes simplistic movement , Scientific Reports, 14(1): 2024,11933

Hou Y, Zhu Y, Ji J, Richardson AG, Liu X A wireless sensor-brain interface system for tracking and guiding animal behaviors through closed-loop neuromodulation in water mazes , IEEE Journal of Solid State Circuits, 59(4): 2024,1093-1109

Ding Y, Du L, Hao H, Mier TCE, Van der Spiegel J, Lucas TH, Aflatouni F, Richardson AG, Allen MG A biocompatible glass-encapsulated triaxial force sensor for implantable tactile sensing applications , IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 2024: 2024,821-824

Hou Y, Zhu Y, Wu X, Li Y, Lucas TH, Richardson AG, Liu X A multi-loop neuromodulation chipset network with frequency interleaving front-end and explainable AI for memory studies in freely behaving monkeys , IEEE International Solid-State Circuits Conference (ISSCC), 2024: 2024,548-550

Hao H, Richardson AG, Ding Y, Du L, Allen MG, Van der Spiegel J, Aflatouni F A 0.4V, 750nW, individually accessible wireless capacitive sensor interface IC for a tactile sensing network , IEEE International Solid-State Circuits Conference (ISSCC), 2024: 2024,332-334